Application: All high-density boards
Product Features: Small surface mount, Solid state
Faster time to trip than standard SMD devices
Lower resistance than standard SMD devices
Operation Current: 50mA~1.5A
Maximum Voltage: 6V~60V
Temperature Range: -40＜C to 85＜C
Agency Recognition: Pending

　
　
　
Part
Number		 Hold
Current		 Trip
Current		 Rated
Voltage
　		 Maximum
Current
　		 Typical
Power
　		 Max Time to Trip Resistance Tolerance
RMIN R1MAX
IH, A IT, A VMAX,Vdc IMAX, A Pd, W Current Time ohms ohms
FSMD005-1206 0.05 0.15 60 10 0.4 0.25 1.50 3.60 50.0
FSMD010-1206 0.10 0.25 60 10 0.4 0.5 1.00 2.10 15.0
FSMD020-1206 0.20 0.40 30 10 0.4 8 0.05 0.60 2.500
FSMD035-1206 0.35 0.75 16 40 0.4 8 0.10 0.300 1.200
FSMD050-1206 0.5 1.00 8 40 0.4 8 0.10 0.150 0.700
FSMD075-1206 0.75 1.50 6 40 0.6 8 0.20 0.100 0.290
FSMD100-1206 1.00 1.80 6 40 0.6 8 0.30 0.055 0.210
FSMD150-1206 1.50 3.00 6 40 0.8 8 1.00 0.040 0.120
　 IH=Hold current-maximum current at which the device will not trip at 23＜C still air.
IT=Trip current-minimum current at which the device will always trip at 23＜C still air.
V MAX=Maximum voltage device can withstand without damage at its rated current.
I MAX= Maximum fault current device can withstand without damage at rated voltage (V max).
Pd=Typical power dissipated from device when in the tripped state in 23＜C still air environment.
RMIN=Minimum device resistance at 23＜C.
R1MAX=Maximum device resistance at 23＜C, 1 hour after tripping .
Termination pad characteristics
Termination pad materials: solder-plated copper

　
　
Part
Number
A
B
C
D
Min
Max
Min
Max
Min
Max
Min
FSMD005-1206 3.0 3.5 1.50 1.80 0.45 0.75 0.10
FSMD010-1206 3.0 3.5 1.50 1.80 0.45 0.75 0.10
FSMD020-1206 3.0 3.5 1.50 1.80 0.45 0.75 0.10
FSMD035-1206 3.0 3.5 1.50 1.80 0.45 0.75 0.10
FSMD050-1206 3.0 3.5 1.50 1.80 0.45 0.75 0.10
FSMD075-1206 3.0 3.5 1.50 1.80 0.45 1.25 0.10
FSMD100-1206 3.0 3.5 1.50 1.80 0.75 1.25 0.10
FSMD150-1206 3.0 3.5 1.50 1.80 1.45 1.25 0.10

　
　
　

　
　
　
Z =FSMD005-1206
A =FSMD010-1206
B =FSMD020-1206
C =FSMD035-1206
D =FSMD050-1206
E =FSMD075-1206
F =FSMD100-1206
G =FSMD150-1206
　
　
FZ =FSMD005-1206
FA =FSMD010-1206
FB =FSMD020-1206
FC =FSMD035-1206
FD =FSMD050-1206
FE =FSMD075-1206
FF =FSMD100-1206
FG =FSMD150-1206

　
　
　
P/N
Pcs /Bag
Reel/Tape
FSMD005-1206
-----
4K
FSMD010-1206
-----
4K
FSMD020-1206
-----
4K
FSMD035-1206
-----
4K
　
P/N
Pcs /Bag
Reel/Tape
FSMD050-1206
-----
4K
FSMD075-1206
-----
4K
FSMD100-1206
-----
4K
FSMD150-1206 ----- 4K

　
　
Warning:
  1. Operation beyond the specified maximum ratings or improper use may result in damage and possible electrical arcing and/or flame.
  2. PPTC device are intended for occasional overcurrent protection. Application for repeated overcurrent condition and/or prolonged trip are not anticipated.
  3. Avoid contact of PPTC device with chemical solvent. Prolonged contact will damage the device performance.

　
　
Pad Layouts, Solder Reflow and Rework Recommendations
The dimension in the table below provide the recommended pad layout for each FSMD1812 device
Pad dimensions (millimeters)
Device A B C
Nominal Nominal Nominal
FSMD005-1206 2.00 1.00 2.50
FSMD010-1206 2.00 1.00 2.50
FSMD020-1206 2.00 1.00 2.50
FSMD035-1206 2.00 1.00 2.50
FSMD050-1206 2.00 1.00 2.50
FSMD075-1206 2.00 1.00 2.50
FSMD100-1206 2.00 1.00 2.50
FSMD150-1206 2.00 1.00 2.50

Solder reflow
Due to ＾Lead Free￣ nature, up to 40 seconds Dwelling time for the soldering zone is strongly recommend .
1. Recommended reflow methods; IR, vapor phase oven, hot air oven.
2. The FSMD1812 Series are suitable for use with wave-solder application methods.
3. Recommended maximum paste thickness is 0.25mm.
4. Devices can be cleaned using standard industry methods and solvents.

CAUTION:
If reflow temperatures exceed the recommended Profile, devices may not meet the performance requirements.

Rework:
Use standard industry practices.

All the specifications are subject to change without previous notice.